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1 Ergebnisse
1
Effects of Ge addition on the growth of interfacial Ni3Sn4 ..:
, In:
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
,
Zhang, Shasha
;
Ye, Ziting
;
Wei, Yuhang
... - p. 1-6 , 2023
Link:
https://doi.org/10.1109/ICEPT59018.2023.10492030
RT T1 <cTitle>2023 24th International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Effects of Ge addition on the growth of interfacial Ni3Sn4 IMC in the Sn58Bi/Ni solder joint: First-principles and Experimental Investigations</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10492030&Exemplar=1&LAN=DE A1 Zhang, Shasha A1 Ye, Ziting A1 Wei, Yuhang A1 Sheng, Bo A1 Dong, Zhaoteng A1 Zheng, Bing A1 Zhao, Xiuchen YR 2023 SN 2836-9734 K1 Discrete Fourier transforms K1 Doping K1 Atoms K1 Germanium K1 Nickel K1 Intermetallic K1 Soldering K1 Low temperature solder K1 Intermetallic compound K1 First-principle K1 Diffusion SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT59018.2023.10492030 DO https://doi.org/10.1109/ICEPT59018.2023.10492030 SF ELIB - SuUB Bremen
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