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1 Ergebnisse
1
Design and characterization of novel doped heterostructured..:
, In:
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
,
Huang, Haichao
;
Wang, Shuaipeng
;
Chen, Yanning
... - p. 1-5 , 2023
Link:
https://doi.org/10.1109/ICEPT59018.2023.10492031
RT T1
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
: T1
Design and characterization of novel doped heterostructured electromagnetic shielding packaging materials for Current sensor chip applications
UL https://suche.suub.uni-bremen.de/peid=ieee-10492031&Exemplar=1&LAN=DE A1 Huang, Haichao A1 Wang, Shuaipeng A1 Chen, Yanning A1 Fu, Zhen A1 Li, Yongfu A1 Jiang, Xiping YR 2023 SN 2836-9734 K1 Optical fiber sensors K1 Microwave integrated circuits K1 Dielectric losses K1 Metals K1 Conductivity K1 Packaging K1 Reflection K1 Heterogeneous Structure K1 Electromagnetic Shielding K1 Packaging materials SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT59018.2023.10492031 DO https://doi.org/10.1109/ICEPT59018.2023.10492031 SF ELIB - SuUB Bremen
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