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1 Ergebnisse
1
Preparation of Nano-foam Sheet and Its Application in High ..:
, In:
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
,
Zhang, Hongqiang
;
Yin, Changhao
;
Zhang, Jiahe
.. - p. 1-3 , 2023
Link:
https://doi.org/10.1109/ICEPT59018.2023.10492041
RT T1
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
: T1
Preparation of Nano-foam Sheet and Its Application in High Temperature Packaging of Power Chips
UL https://suche.suub.uni-bremen.de/peid=ieee-10492041&Exemplar=1&LAN=DE A1 Zhang, Hongqiang A1 Yin, Changhao A1 Zhang, Jiahe A1 He, Siliang A1 Guo, Wei YR 2023 SN 2836-9734 K1 Temperature K1 Silicon carbide K1 Sintering K1 Surface morphology K1 Thermal conductivity K1 Etching K1 Surface cracks K1 sintered nano foam K1 die attach K1 high-temperature reliability K1 power electronics SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT59018.2023.10492041 DO https://doi.org/10.1109/ICEPT59018.2023.10492041 SF ELIB - SuUB Bremen
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