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1 Ergebnisse
1
Investigation of Moisture Influence on Structure and Therma..:
, In:
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
,
Sheng, Can
;
He, Tao
;
Zhang, Wenze
.. - p. 1-6 , 2023
Link:
https://doi.org/10.1109/ICEPT59018.2023.10492047
RT T1 <cTitle>2023 24th International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Investigation of Moisture Influence on Structure and Thermal Conductivity of Epoxy Resin by Molecular Dynamics Simulation</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10492047&Exemplar=1&LAN=DE A1 Sheng, Can A1 He, Tao A1 Zhang, Wenze A1 Wang, Shizhao A1 Liu, Sheng YR 2023 SN 2836-9734 K1 Hydrogen K1 Moisture K1 Epoxy resins K1 Conductivity K1 Reliability theory K1 Thermal conductivity K1 Electronic packaging thermal management K1 Epoxy Resin K1 Molecular Dynamics K1 Crosslinking K1 Thermal Conductivity SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT59018.2023.10492047 DO https://doi.org/10.1109/ICEPT59018.2023.10492047 SF ELIB - SuUB Bremen
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