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1 Ergebnisse
1
CPU Socket Interposer Component Level and PCBA Manufacturab..:
, In:
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
,
Wang, Paul
;
Feng, Top
;
Wang, Rocky
... - p. 1-7 , 2023
Link:
https://doi.org/10.1109/ICEPT59018.2023.10492049
RT T1 <cTitle>2023 24th International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>CPU Socket Interposer Component Level and PCBA Manufacturability Study and Part 2: iNEMI 2023 Board Assembly – CPU Socket Technology Roadmap</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10492049&Exemplar=1&LAN=DE A1 Wang, Paul A1 Feng, Top A1 Wang, Rocky A1 Dandia, Sanjay A1 Liang, Changwei A1 Nekkanty, Srikant A1 Szu, Simon A1 Dai, Homer A1 Bath, Jasbir YR 2023 SN 2836-9734 K1 Temperature measurement K1 Sockets K1 Thermal resistance K1 Packaging K1 Market research K1 Pins K1 Thermal stresses K1 CPU socket K1 interconnect K1 computer K1 high data speed K1 high signal integrity K1 socket design K1 manufacturability K1 iNEMI K1 roadmap SP 1 OP 7 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT59018.2023.10492049 DO https://doi.org/10.1109/ICEPT59018.2023.10492049 SF ELIB - SuUB Bremen
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