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1 Ergebnisse
1
A low power consumption fractal microchannel heat sink base..:
, In:
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
,
Wu, Yongjin
;
Ma, Changbei
;
Luo, Jiangbo
... - p. 1-5 , 2023
Link:
https://doi.org/10.1109/ICEPT59018.2023.10492055
RT T1 <cTitle>2023 24th International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>A low power consumption fractal microchannel heat sink based on hierarchical ribs</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10492055&Exemplar=1&LAN=DE A1 Wu, Yongjin A1 Ma, Changbei A1 Luo, Jiangbo A1 Sun, Yunnan A1 Xie, Dongdong A1 Ding, Guifu A1 Wang, Kai A1 Wang, Yan A1 Yang, Zhuoqing A1 Shen, Shengnan YR 2023 SN 2836-9734 K1 Heating systems K1 Performance evaluation K1 Thermal management of electronics K1 Power demand K1 Simulation K1 Heat sinks K1 Ribs K1 low power consumption K1 fractal microchannel K1 hierarchical rib K1 multiple outlets K1 microchannel heat sink SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT59018.2023.10492055 DO https://doi.org/10.1109/ICEPT59018.2023.10492055 SF ELIB - SuUB Bremen
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