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FOStrip Technique for Low-Cost Fan-Out Package:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Lin, I-Hung ; Chen, Yu-Tai ; Huang, Ji-Ting... - p. 1-4 , 2023
Link: https://doi.org/10.1109/ICEPT59018.2023.10492056