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Effect of Solder Thick on the Interfacial Reaction in Cu/Sn..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Liang, Wang-rong ; Zhang, Zhi-jie ; Dang, Rui-xi.. - p. 1-4 , 2023
Link: https://doi.org/10.1109/ICEPT59018.2023.10492059