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1 Ergebnisse
1
A Thin Film Metallization Process Development for Silicon N..:
, In:
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
,
Chen, Xin
;
Zhang, Donglin
;
Song, Jiaqi
... - p. 1-5 , 2023
Link:
https://doi.org/10.1109/ICEPT59018.2023.10492067
RT T1 <cTitle>2023 24th International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>A Thin Film Metallization Process Development for Silicon Nitride Ceramic Substrates in Power Electronics Packaging</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10492067&Exemplar=1&LAN=DE A1 Chen, Xin A1 Zhang, Donglin A1 Song, Jiaqi A1 Xu, Tao A1 Tian, Xin A1 Zhao, Xiuchen A1 Huo, Yongjun YR 2023 SN 2836-9734 K1 Silver K1 Metallization K1 Surface morphology K1 Packaging K1 Titanium K1 Power electronics K1 Ceramics K1 Power electronics packaging K1 Silicon nitride K1 Ceramics substrate K1 Thin film metallization K1 Materials characterizations SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT59018.2023.10492067 DO https://doi.org/10.1109/ICEPT59018.2023.10492067 SF ELIB - SuUB Bremen
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