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1 Ergebnisse
1
Research of 3D-TSV crystal plastic constitutive and Optimiz..:
, In:
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
,
Hou, Kaihong
;
Fan, Zhengwei
;
Chen, Xun
... - p. 1-6 , 2023
Link:
https://doi.org/10.1109/ICEPT59018.2023.10492083
RT T1 <cTitle>2023 24th International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Research of 3D-TSV crystal plastic constitutive and Optimization of electroplated copper filling</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10492083&Exemplar=1&LAN=DE A1 Hou, Kaihong A1 Fan, Zhengwei A1 Chen, Xun A1 Zhang, Shufeng A1 Yu, Dianlong A1 Wang, Yashun YR 2023 SN 2836-9734 K1 Electrochemical deposition K1 Deformation K1 Crystals K1 Filling K1 Plastics K1 Copper K1 Reliability K1 Through-silicon-via (TSV) K1 Crystal plastic constitutive K1 Electroplated copper filling K1 Capillary copper pipe SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT59018.2023.10492083 DO https://doi.org/10.1109/ICEPT59018.2023.10492083 SF ELIB - SuUB Bremen
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