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1 Ergebnisse
1
Thermal Resistance Simulation Analysis and Test Research of..:
, In:
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
,
Qu, Fang
;
Yan, Bin
;
Wang, Zongwei
... - p. 1-5 , 2023
Link:
https://doi.org/10.1109/ICEPT59018.2023.10492091
RT T1 <cTitle>2023 24th International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Thermal Resistance Simulation Analysis and Test Research of Wire Bond Ball Grid Array Package</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10492091&Exemplar=1&LAN=DE A1 Qu, Fang A1 Yan, Bin A1 Wang, Zongwei A1 Tian, Zhongxuan A1 Pang, Jian A1 Li, Guangyao A1 Hu, Xuequan A1 Ouyang, Keqing YR 2023 SN 2836-9734 K1 Thermal resistance K1 Simulation K1 Wires K1 Packaging K1 Conductivity K1 Electronic packaging thermal management K1 Thermal conductivity K1 wbbga K1 thermal resistance K1 thermal simulation K1 thermal text SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT59018.2023.10492091 DO https://doi.org/10.1109/ICEPT59018.2023.10492091 SF ELIB - SuUB Bremen
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