I agree that this site is using cookies. You can find further informations
here
.
X
Login
Merkliste (
0
)
Home
About us
Home About us
Our history
Profile
Press & public relations
Friends
The library in figures
Exhibitions
Projects
Training, internships, careers
Films
Services & Information
Home Services & Information
Lending and interlibrary loans
Returns and renewals
Training and library tours
My Account
Library cards
New to the library?
Download Information
Opening hours
Learning spaces
PC, WLAN, copy, scan and print
Catalogs and collections
Home Catalogs and Collections
Rare books and manuscripts
Digital collections
Subject Areas
Our sites
Home Our sites
Central Library
Law Library (Juridicum)
BB Business and Economics (BB11)
BB Physics and Electrical Engineering
TB Engineering and Social Sciences
TB Economics and Nautical Sciences
TB Music
TB Art & Design
TB Bremerhaven
Contact the library
Home Contact the library
Staff Directory
Open access & publishing
Home Open access & publishing
Reference management: Citavi & RefWorks
Publishing documents
Open Access in Bremen
zur Desktop-Version
Toggle navigation
Merkliste
1 Ergebnisse
1
Quantitative Microstructural Data of Bulk Solders and Joint..:
, In:
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
,
Zheng, Kaiwen
;
Huang, Zhiheng
;
Xiao, Min
... - p. 1-6 , 2023
Link:
https://doi.org/10.1109/ICEPT59018.2023.10492095
RT T1 <cTitle>2023 24th International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Quantitative Microstructural Data of Bulk Solders and Joints under a New Framework of MicroStructure Hierarchy Descriptor (μSHD)</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10492095&Exemplar=1&LAN=DE A1 Zheng, Kaiwen A1 Huang, Zhiheng A1 Xiao, Min A1 Meng, Yuezhong A1 Yan, Hui A1 Liu, Yang YR 2023 SN 2836-9734 K1 Electromigration K1 Temperature distribution K1 Systematics K1 Cooling K1 Market research K1 Microstructure K1 Soldering K1 bulk solder K1 solder joint K1 MicroStructure Hierarchy Descriptor K1 intermetallic compound K1 scale and orientation SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT59018.2023.10492095 DO https://doi.org/10.1109/ICEPT59018.2023.10492095 SF ELIB - SuUB Bremen
Export
RefWorks (nur Desktop-Version!)
Flow
(Zuerst in
Flow
einloggen, dann importieren)
