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1 Ergebnisse
1
Orientation-related stress analysis of nanotwinned copper i..:
, In:
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
,
Wang, Zesong
;
Zhong, Cheng
;
Li, Peifeng
. - p. 1-5 , 2023
Link:
https://doi.org/10.1109/ICEPT59018.2023.10492100
RT T1 <cTitle>2023 24th International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Orientation-related stress analysis of nanotwinned copper in redistributed layer for wafer-level packaging</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10492100&Exemplar=1&LAN=DE A1 Wang, Zesong A1 Zhong, Cheng A1 Li, Peifeng A1 Liu, Zhi-Quan YR 2023 SN 2836-9734 K1 Deformation K1 Simulation K1 Curing K1 Anisotropic K1 Finite element analysis K1 Copper K1 Plastics K1 Stress distribution K1 redistributed layer (RDL) K1 nanotwinned Copper (NT-Cu) K1 anisotropy K1 finite element analysis (FEA) SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT59018.2023.10492100 DO https://doi.org/10.1109/ICEPT59018.2023.10492100 SF ELIB - SuUB Bremen
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