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1 Ergebnisse
1
Correlation Analysis between Warpage and Metal Thermal Inte..:
, In:
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
,
Wu, Zhuolun
;
Wang, Zhuqiu
;
Qi, Di
... - p. 1-4 , 2023
Link:
https://doi.org/10.1109/ICEPT59018.2023.10492102
RT T1 <cTitle>2023 24th International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Correlation Analysis between Warpage and Metal Thermal Interface Materials Thermo-mechanical Reliability of Large size FCBGA</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10492102&Exemplar=1&LAN=DE A1 Wu, Zhuolun A1 Wang, Zhuqiu A1 Qi, Di A1 Lin, Xinyi A1 Yang, Dan A1 Mei, Na YR 2023 SN 2836-9734 K1 Correlation K1 Temperature K1 Thermomechanical processes K1 Metals K1 Materials reliability K1 Electronic packaging thermal management K1 Reliability engineering K1 Thermal Interface Materials(TIM) K1 warpage K1 Pearson correlation coefficient K1 Design of Experiment(DOE) K1 Finite Element Analysis(FEA) SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT59018.2023.10492102 DO https://doi.org/10.1109/ICEPT59018.2023.10492102 SF ELIB - SuUB Bremen
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