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1 Ergebnisse
1
Lifetime model of copper pillar micro-bump interconnects un..:
, In:
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
,
Fu, Zhiwei
;
Hao, Tongsen
;
Xiao, Qingzhong
... - p. 1-5 , 2023
Link:
https://doi.org/10.1109/ICEPT59018.2023.10492109
RT T1 <cTitle>2023 24th International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Lifetime model of copper pillar micro-bump interconnects under bi-directional pulse current stress</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10492109&Exemplar=1&LAN=DE A1 Fu, Zhiwei A1 Hao, Tongsen A1 Xiao, Qingzhong A1 Xu, Jile A1 Zheng, Bingjie A1 Yang, Jia-Yue YR 2023 SN 2836-9734 K1 Electromigration K1 Temperature distribution K1 Bidirectional control K1 Life estimation K1 Mathematical models K1 Numerical models K1 Reliability K1 bi-directional pulse K1 microbump K1 electric migration K1 lifetime model SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT59018.2023.10492109 DO https://doi.org/10.1109/ICEPT59018.2023.10492109 SF ELIB - SuUB Bremen
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