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1 Ergebnisse
1
High Density Multi-Chip Embedded Panel-Level Packaging Inte..:
, In:
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
,
Chen, Xianming
;
Huang, Benxia
;
Hong, Yejie
... - p. 1-6 , 2023
Link:
https://doi.org/10.1109/ICEPT59018.2023.10492121
RT T1 <cTitle>2023 24th International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>High Density Multi-Chip Embedded Panel-Level Packaging Integration Technology</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10492121&Exemplar=1&LAN=DE A1 Chen, Xianming A1 Huang, Benxia A1 Hong, Yejie A1 Feng, Lei A1 Feng, Jindong A1 Zhu, Guilin A1 Huang, Gao A1 Dong, Yanlin A1 Chen, Wu YR 2023 SN 2836-9734 K1 Heating systems K1 Costs K1 Packaging K1 Thermal management K1 Solids K1 Copper K1 Transistors K1 Panel-Level K1 Multi-Chip Embedded K1 High Density K1 Packaging Integration Technology K1 High-Performance SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT59018.2023.10492121 DO https://doi.org/10.1109/ICEPT59018.2023.10492121 SF ELIB - SuUB Bremen
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