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1 Ergebnisse
1
Life Prediction of Solder Interconnects under Harsh Thermal..:
, In:
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
,
Jiang, Wanyu
;
Xu, Jingwen
;
Wang, Jing
... - p. 1-10 , 2023
Link:
https://doi.org/10.1109/ICEPT59018.2023.10492136
RT T1
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
: T1
Life Prediction of Solder Interconnects under Harsh Thermal Cycling from Microstructural Degradation
UL https://suche.suub.uni-bremen.de/peid=ieee-10492136&Exemplar=1&LAN=DE A1 Jiang, Wanyu A1 Xu, Jingwen A1 Wang, Jing A1 Hu, Hao A1 Zhang, Wei A1 An, Rong YR 2023 SN 2836-9734 K1 Temperature measurement K1 Photovoltaic systems K1 Geometry K1 Predictive models K1 Fatigue K1 Mathematical models K1 Reliability K1 Interconnection K1 Soldering K1 Solar array SP 1 OP 10 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT59018.2023.10492136 DO https://doi.org/10.1109/ICEPT59018.2023.10492136 SF ELIB - SuUB Bremen
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