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1 Ergebnisse
1
Full Ni3Sn4 IMC interconnects prepared by current driven bo..:
, In:
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
,
Chen, Zhikai
;
Liu, Peng
;
Ren, Jing
. - p. 1-6 , 2023
Link:
https://doi.org/10.1109/ICEPT59018.2023.10492153
RT T1 <cTitle>2023 24th International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Full Ni3Sn4 IMC interconnects prepared by current driven bonding (CDB) method</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10492153&Exemplar=1&LAN=DE A1 Chen, Zhikai A1 Liu, Peng A1 Ren, Jing A1 Huang, Mingliang YR 2023 SN 2836-9734 K1 Grain boundaries K1 Electromigration K1 Aging K1 Mechanical factors K1 Microstructure K1 Intermetallic K1 Anodes K1 Full IMC interconnects K1 Current driven bonding K1 Ni3Sn4 K1 Growth behavior SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT59018.2023.10492153 DO https://doi.org/10.1109/ICEPT59018.2023.10492153 SF ELIB - SuUB Bremen
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