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1 Ergebnisse
1
Effect of Er and Ni-CNTs on the interfacial reaction and gr..:
, In:
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
,
Li, Qi
;
Gao, Haitao
;
Zhang, Xueying
... - p. 1-7 , 2023
Link:
https://doi.org/10.1109/ICEPT59018.2023.10492161
RT T1
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
: T1
Effect of Er and Ni-CNTs on the interfacial reaction and growth behavior of Sn58Bi/Cu intermetallic compound layers
UL https://suche.suub.uni-bremen.de/peid=ieee-10492161&Exemplar=1&LAN=DE A1 Li, Qi A1 Gao, Haitao A1 Zhang, Xueying A1 Liu, FengMei A1 Cai, Zhihong A1 Yi, Jianglong YR 2023 SN 2836-9734 K1 Welding K1 Aging K1 Solids K1 Nickel K1 Intermetallic K1 Compounds K1 Electronics packaging K1 Sn58Bi K1 Ni-CNTs K1 IMC K1 Solid-state aging SP 1 OP 7 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT59018.2023.10492161 DO https://doi.org/10.1109/ICEPT59018.2023.10492161 SF ELIB - SuUB Bremen
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