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1 Ergebnisse
1
Study on the effect of solder flux on the reliability of ce..:
, In:
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
,
Yang, Zhen-tao
;
Yu, Fei
;
Chen, Jiang-tao
. - p. 1-4 , 2023
Link:
https://doi.org/10.1109/ICEPT59018.2023.10492163
RT T1
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
: T1
Study on the effect of solder flux on the reliability of ceramic Package
UL https://suche.suub.uni-bremen.de/peid=ieee-10492163&Exemplar=1&LAN=DE A1 Yang, Zhen-tao A1 Yu, Fei A1 Chen, Jiang-tao A1 Ren, Hao-di YR 2023 SN 2836-9734 K1 Micromechanical devices K1 Gold K1 Welding K1 Tin K1 Data processing K1 Software K1 Ceramics K1 Microsystems K1 Gold tin solder K1 Diaspora K1 Ceramic cracking K1 Finite element simulation SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT59018.2023.10492163 DO https://doi.org/10.1109/ICEPT59018.2023.10492163 SF ELIB - SuUB Bremen
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