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1 Ergebnisse
1
Transmission Structures Using Parylene C and TSV for Silico..:
, In:
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
,
Wang, Qi
;
Wen, Bo
;
Chen, Lang
.. - p. 1-4 , 2023
Link:
https://doi.org/10.1109/ICEPT59018.2023.10492167
RT T1 <cTitle>2023 24th International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Transmission Structures Using Parylene C and TSV for Silicon-based Low-loss and Low-profile Heterogeneous Integrations at Ka-band</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10492167&Exemplar=1&LAN=DE A1 Wang, Qi A1 Wen, Bo A1 Chen, Lang A1 Wang, Wei A1 Jin, Yufeng YR 2023 SN 2836-9734 K1 Radio frequency K1 Wireless communication K1 Power transmission lines K1 Multichip modules K1 Insertion loss K1 Propagation losses K1 Silicon K1 Radio Frequency (RF) K1 Coplanar Waveguide (CPW) K1 Substrate-Integrated Waveguide (SIW) K1 Embedded Silicon Fan-Out (eSiFO) K1 Insertion Loss SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT59018.2023.10492167 DO https://doi.org/10.1109/ICEPT59018.2023.10492167 SF ELIB - SuUB Bremen
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