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1 Ergebnisse
1
A junction temperature prediction model for 3D stacked pack..:
, In:
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
,
Liu, Jiahao
;
Chen, Fangzhou
;
Zhao, Hao
... - p. 1-5 , 2023
Link:
https://doi.org/10.1109/ICEPT59018.2023.10492176
RT T1 <cTitle>2023 24th International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>A junction temperature prediction model for 3D stacked packaging chip based on thermal resistance matrix</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10492176&Exemplar=1&LAN=DE A1 Liu, Jiahao A1 Chen, Fangzhou A1 Zhao, Hao A1 Xiao, Hui A1 Diao, He A1 Zhong, Xiangxiang A1 Wang, Fengyi A1 Liu, Hao A1 Guo, Xiaotong YR 2023 SN 2836-9734 K1 Couplings K1 Solid modeling K1 Three-dimensional displays K1 Thermal resistance K1 Predictive models K1 Packaging K1 Electronic packaging thermal management K1 3D packaging K1 Resistance matrix K1 Thermal coupling effect K1 Junction temperature prediction K1 Finite element analysis SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT59018.2023.10492176 DO https://doi.org/10.1109/ICEPT59018.2023.10492176 SF ELIB - SuUB Bremen
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