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Underfill Flow Numerical Simulation for Achieving Board Lev..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Jiang, Yiming ; Shi, Hongbin ; Lv, Xiang - p. 1-7 , 2023
Link: https://doi.org/10.1109/ICEPT59018.2023.10492193