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1 Ergebnisse
1
SIP Solder Paste via Powder Cluster Design Harvest Both Slu..:
, In:
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
,
Xu, Zhengfeng
;
Wang, Jian
;
Lee, Ning-Cheng
... - p. 1-4 , 2023
Link:
https://doi.org/10.1109/ICEPT59018.2023.10492196
RT T1 <cTitle>2023 24th International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>SIP Solder Paste via Powder Cluster Design Harvest Both Slump Resistance and Temperature Cycling Reliability</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10492196&Exemplar=1&LAN=DE A1 Xu, Zhengfeng A1 Wang, Jian A1 Lee, Ning-Cheng A1 Zheng, Aixia A1 Wang, Ming A1 Gu, Qiwei YR 2023 SN 2836-9734 K1 Powders K1 Thermal resistance K1 Metals K1 Materials reliability K1 Reliability engineering K1 Electronic packaging thermal management K1 Soldering K1 SiP K1 solder paste K1 powder cluster K1 slump resistance K1 low melting solder powder K1 LMSP K1 medium temperature solder powder K1 MTSP K1 thermal cycling reliability K1 crack resistance SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT59018.2023.10492196 DO https://doi.org/10.1109/ICEPT59018.2023.10492196 SF ELIB - SuUB Bremen
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