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1 Ergebnisse
1
A Novel UV-curable Modified Epoxy Resin with High Glass Tra..:
, In:
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
,
Zhang, Yexin
;
Lv, Xialei
;
Li, Jinhui
.. - p. 1-5 , 2023
Link:
https://doi.org/10.1109/ICEPT59018.2023.10492202
RT T1 <cTitle>2023 24th International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>A Novel UV-curable Modified Epoxy Resin with High Glass Transition Temperature and Comprehensive Properties</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10492202&Exemplar=1&LAN=DE A1 Zhang, Yexin A1 Lv, Xialei A1 Li, Jinhui A1 Zhang, Guoping A1 Sun, Rong YR 2023 SN 2836-9734 K1 Temperature K1 Films K1 Lithography K1 Epoxy resins K1 Glass K1 Resists K1 Packaging K1 Advanced Packaging K1 Solder Resist K1 Modified Epoxy Resin K1 UV-curable K1 High Glass Transition Temperature SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT59018.2023.10492202 DO https://doi.org/10.1109/ICEPT59018.2023.10492202 SF ELIB - SuUB Bremen
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