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1 Ergebnisse
1
Research on Modeling and IP Technology for High-Speed Optic..:
, In:
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
,
Wang, Haoyan
;
Ye, Yunong
;
Li, Wei
.. - p. 1-6 , 2023
Link:
https://doi.org/10.1109/ICEPT59018.2023.10492212
RT T1 <cTitle>2023 24th International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Research on Modeling and IP Technology for High-Speed Optical Interconnection Interfaces in Optoelectronic Microsystems</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10492212&Exemplar=1&LAN=DE A1 Wang, Haoyan A1 Ye, Yunong A1 Li, Wei A1 Wang, Zhiqiang A1 Liu, Jie YR 2023 SN 2836-9734 K1 Micromechanical devices K1 Semiconductor device modeling K1 Optical interconnections K1 Reviews K1 Prototypes K1 Silicon-on-insulator K1 Computer architecture K1 optoelectronic microsystem K1 IP technology K1 optical interconnection interface K1 modeling method SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT59018.2023.10492212 DO https://doi.org/10.1109/ICEPT59018.2023.10492212 SF ELIB - SuUB Bremen
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