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1 Ergebnisse
1
Stress-strain analysis and optimization of TSV interconnect..:
, In:
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
,
Wang, Lilin
;
Huang, Chunyue
;
Wu, Liye
... - p. 1-6 , 2023
Link:
https://doi.org/10.1109/ICEPT59018.2023.10492234
RT T1 <cTitle>2023 24th International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Stress-strain analysis and optimization of TSV interconnect structure parameters under thermal cyclic load loading based on bp neural network</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10492234&Exemplar=1&LAN=DE A1 Wang, Lilin A1 Huang, Chunyue A1 Wu, Liye A1 Liu, Xiaobin A1 Liu, Xianjia A1 Zhang, Huaiquan YR 2023 SN 2836-9734 K1 Silicon compounds K1 Loading K1 Neural networks K1 Electronic packaging thermal management K1 Thermal analysis K1 Finite element analysis K1 Thermal loading K1 Three-dimensional packaging K1 TSV interconnect structure K1 finite element analysis K1 thermal cycling load K1 orthogonal test design K1 BP neural network SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT59018.2023.10492234 DO https://doi.org/10.1109/ICEPT59018.2023.10492234 SF ELIB - SuUB Bremen
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