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1 Ergebnisse
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Failure analysis and improvement research on flexible termi..:
, In:
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
,
Cao, Rui
;
Wu, Yaning
;
Zhou, Dandan
... - p. 1-5 , 2023
Link:
https://doi.org/10.1109/ICEPT59018.2023.10492249
RT T1
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
: T1
Failure analysis and improvement research on flexible termination multilayer ceramic capacitors
UL https://suche.suub.uni-bremen.de/peid=ieee-10492249&Exemplar=1&LAN=DE A1 Cao, Rui A1 Wu, Yaning A1 Zhou, Dandan A1 Hou, Xilu A1 Duan, Lei A1 Zhu, Hengjing YR 2023 SN 2836-9734 K1 Electrodes K1 Scanning electron microscopy K1 Porcelain K1 Failure analysis K1 Ceramic capacitors K1 Nonhomogeneous media K1 Capacitance K1 Multilayer ceramic capacitors K1 Flexible termination K1 bending stress SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT59018.2023.10492249 DO https://doi.org/10.1109/ICEPT59018.2023.10492249 SF ELIB - SuUB Bremen
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