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1 Ergebnisse
1
A Thermo-mechanical Coupled 3D Crystal Plasticity Finite El..:
, In:
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
,
Li, Yang
;
Cheng, Yujie
;
Hu, Shanwen
... - p. 1-6 , 2023
Link:
https://doi.org/10.1109/ICEPT59018.2023.10492258
RT T1 <cTitle>2023 24th International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>A Thermo-mechanical Coupled 3D Crystal Plasticity Finite Element Model for CASTIN Solder Alloy</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10492258&Exemplar=1&LAN=DE A1 Li, Yang A1 Cheng, Yujie A1 Hu, Shanwen A1 Xu, Binbin A1 Liu, Lu A1 Cai, Zhikuang YR 2023 SN 2836-9734 K1 Deformable models K1 Three-dimensional displays K1 Deformation K1 Thermomechanical processes K1 Metals K1 Crystals K1 Finite element analysis K1 CASTIN Solder Alloy K1 3D Crystal Plasticity Finite Element Model K1 Thermo-mechanical Coupled K1 Strain Rate Jump Tests SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT59018.2023.10492258 DO https://doi.org/10.1109/ICEPT59018.2023.10492258 SF ELIB - SuUB Bremen
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