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Simulation on Microstructural Evolution under Electromigrat..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Zeng, Xin ; Huang, Zhiheng ; Xiao, Min... - p. 1-6 , 2023
Link: https://doi.org/10.1109/ICEPT59018.2023.10492263