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1 Ergebnisse
1
A Study on Transmission Loss of Build-up Film Applied to IC..:
, In:
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
,
Kong, Weikun
;
Chen, Wenbo
;
Zhong, Cheng
... - p. 1-5 , 2023
Link:
https://doi.org/10.1109/ICEPT59018.2023.10492264
RT T1 <cTitle>2023 24th International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>A Study on Transmission Loss of Build-up Film Applied to IC Substrate</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10492264&Exemplar=1&LAN=DE A1 Kong, Weikun A1 Chen, Wenbo A1 Zhong, Cheng A1 Chu, Baojin A1 Li, Baozhong A1 Yu, Shuhui YR 2023 SN 2836-9734 K1 Integrated circuits K1 Dielectric losses K1 Propagation losses K1 Conductors K1 Transmission line theory K1 Microstrip K1 High frequency K1 build-up film K1 IC substrate K1 electrical simulation K1 microstrip line K1 transmission loss SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT59018.2023.10492264 DO https://doi.org/10.1109/ICEPT59018.2023.10492264 SF ELIB - SuUB Bremen
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