I agree that this site is using cookies. You can find further informations here.
X
Merkliste 
 1 Ergebnisse 
 
1

Quantitative analysis of the interface strength of ultra-th..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Sun, Zhanxing ; Ding, Fei ; Ma, Rui... - p. 1-6 , 2023
Link: https://doi.org/10.1109/ICEPT59018.2023.10492268