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1 Ergebnisse
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Quantitative analysis of the interface strength of ultra-th..:
, In:
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
,
Sun, Zhanxing
;
Ding, Fei
;
Ma, Rui
... - p. 1-6 , 2023
Link:
https://doi.org/10.1109/ICEPT59018.2023.10492268
RT T1
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
: T1
Quantitative analysis of the interface strength of ultra-thin dielectric films based on fan-out packaging
UL https://suche.suub.uni-bremen.de/peid=ieee-10492268&Exemplar=1&LAN=DE A1 Sun, Zhanxing A1 Ding, Fei A1 Ma, Rui A1 Wang, Qidong A1 Jing, Xiangmeng A1 Su, Meiying A1 Cao, Liqiang YR 2023 SN 2836-9734 K1 Statistical analysis K1 Polyimides K1 Packaging K1 Dielectrics K1 Dielectric films K1 Reliability K1 Delamination K1 Polyimide K1 Interface strength K1 Reliability test SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT59018.2023.10492268 DO https://doi.org/10.1109/ICEPT59018.2023.10492268 SF ELIB - SuUB Bremen
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