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1 Ergebnisse
1
High energy dissipation composite elastomer for application..:
, In:
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
,
Wu, Weijian
;
Wang, Hangqian
;
Zeng, Xiangliang
... - p. 1-6 , 2023
Link:
https://doi.org/10.1109/ICEPT59018.2023.10492270
RT T1 <cTitle>2023 24th International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>High energy dissipation composite elastomer for application as a thermal interface material through solvent-induced dis-entanglement</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10492270&Exemplar=1&LAN=DE A1 Wu, Weijian A1 Wang, Hangqian A1 Zeng, Xiangliang A1 Hao, Zhifeng A1 Fan, Jianfeng A1 Ren, Linlin YR 2023 SN 2836-9734 K1 Energy dissipation K1 Elastomers K1 Conductivity K1 Thermal conductivity K1 Thermal management K1 Market research K1 Electronic packaging thermal management K1 Elastomer composites K1 thermal conductivity K1 toughness K1 stretchability K1 energy dissipation capacity SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT59018.2023.10492270 DO https://doi.org/10.1109/ICEPT59018.2023.10492270 SF ELIB - SuUB Bremen
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