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1 Ergebnisse
1
Structural Analysis of Anisotropic Conductive Film for Liqu..:
, In:
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
,
Xu, Yadong
;
Wang, Yong
;
Liu, Xuebi
... - p. 1-4 , 2023
Link:
https://doi.org/10.1109/ICEPT59018.2023.10492272
RT T1 <cTitle>2023 24th International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Structural Analysis of Anisotropic Conductive Film for Liquid Crystal Displays and Semiconductor Packaging Applications</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10492272&Exemplar=1&LAN=DE A1 Xu, Yadong A1 Wang, Yong A1 Liu, Xuebi A1 Lu, Xi A1 Lin, Zhiqiang A1 Wan, Yanjun A1 Li, Jianhui A1 Long, Haohui A1 Hu, Yougen A1 Sun, Rong YR 2023 SN 2836-9734 K1 Electrodes K1 Resistance K1 Circuits K1 Anisotropic conductive films K1 Materials reliability K1 Packaging K1 Reliability engineering K1 anisotropic conductive film K1 structural configuration K1 particle capture rate K1 liquid crystal display SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT59018.2023.10492272 DO https://doi.org/10.1109/ICEPT59018.2023.10492272 SF ELIB - SuUB Bremen
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