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1 Ergebnisse
1
Effect of Cu content in the Ni-Cu under-bump metallurgy on ..:
, In:
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
,
Li, Xiaofu
;
Xing, Jing
;
Chen, Xiangxu
.. - p. 1-5 , 2023
Link:
https://doi.org/10.1109/ICEPT59018.2023.10492273
RT T1
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
: T1
Effect of Cu content in the Ni-Cu under-bump metallurgy on the interfacial reaction between Ni1-xCux and Sn solder
UL https://suche.suub.uni-bremen.de/peid=ieee-10492273&Exemplar=1&LAN=DE A1 Li, Xiaofu A1 Xing, Jing A1 Chen, Xiangxu A1 Yao, Jinye A1 Ma, Haitao YR 2023 SN 2836-9734 K1 Metallization K1 Process control K1 Morphology K1 Predictive models K1 Kinetic theory K1 Metallurgy K1 Intermetallic K1 Ni-Cu UBM K1 Sn solder K1 Interfacial reactions SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT59018.2023.10492273 DO https://doi.org/10.1109/ICEPT59018.2023.10492273 SF ELIB - SuUB Bremen
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