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1 Ergebnisse
1
A Combined Experimental and Analytical Study of Residual St..:
, In:
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
,
Li, Xiang
;
Zhong, Hua
;
Zhao, Xianhang
.. - p. 1-3 , 2023
Link:
https://doi.org/10.1109/ICEPT59018.2023.10492276
RT T1 <cTitle>2023 24th International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>A Combined Experimental and Analytical Study of Residual Strains Developed in Encapsulated Structures</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10492276&Exemplar=1&LAN=DE A1 Li, Xiang A1 Zhong, Hua A1 Zhao, Xianhang A1 Liu, Xin A1 Li, Yuefang YR 2023 SN 2836-9734 K1 Temperature measurement K1 Temperature distribution K1 Thermocouples K1 Curing K1 Numerical models K1 Finite element analysis K1 Electron tubes K1 Epoxy encapsulation K1 Residual stress SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT59018.2023.10492276 DO https://doi.org/10.1109/ICEPT59018.2023.10492276 SF ELIB - SuUB Bremen
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