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1 Ergebnisse
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Prospective application of nanotwinned copper for Damascene..:
, In:
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
,
Gao, Li-Yin
;
Wan, Yong-Qiang
;
Lei, Zhi-Gang
... - p. 1-6 , 2023
Link:
https://doi.org/10.1109/ICEPT59018.2023.10492284
RT T1 <cTitle>2023 24th International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Prospective application of nanotwinned copper for Damascene via filling and hybrid bonding</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10492284&Exemplar=1&LAN=DE A1 Gao, Li-Yin A1 Wan, Yong-Qiang A1 Lei, Zhi-Gang A1 Wang, Yu-Xi A1 Li, Zhe A1 Li, Xiao A1 Liu, Zhi-Quan A1 Sun, Rong YR 2023 SN 2836-9734 K1 Electrochemical deposition K1 Micrometers K1 Additives K1 Temperature K1 Filling K1 Oxidation K1 Acoustics K1 Nanotwinned copper K1 electroplating K1 Damascene K1 transition layer K1 uniformity SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT59018.2023.10492284 DO https://doi.org/10.1109/ICEPT59018.2023.10492284 SF ELIB - SuUB Bremen
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