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1 Ergebnisse
1
Simulation of Crack Initiation and Propagation in Solder La..:
, In:
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
,
Qin, Jiaolong
;
Wu, Fengshun
;
Zhou, Longzao
... - p. 1-6 , 2023
Link:
https://doi.org/10.1109/ICEPT59018.2023.10492289
RT T1 <cTitle>2023 24th International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Simulation of Crack Initiation and Propagation in Solder Layer of IGBT Module under Temperature Shock in 3D Model Based on Phase Field Method</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10492289&Exemplar=1&LAN=DE A1 Qin, Jiaolong A1 Wu, Fengshun A1 Zhou, Longzao A1 Ding, Liguo A1 Liu, Hui A1 Xiang, Yuan YR 2023 SN 2836-9734 K1 Insulated gate bipolar transistors K1 Solid modeling K1 Three-dimensional displays K1 Electric shock K1 Electronics packaging K1 IGBT module K1 crack initiation and propagation K1 temperature shock test K1 viscoplastic phase field method SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT59018.2023.10492289 DO https://doi.org/10.1109/ICEPT59018.2023.10492289 SF ELIB - SuUB Bremen
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