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1 Ergebnisse
1
Cascode GaN device's Electrical Performance Failure Caused ..:
, In:
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
,
Shi, Yijun
;
Wu, Shan
;
He, Zhiyuan
... - p. 1-5 , 2023
Link:
https://doi.org/10.1109/ICEPT59018.2023.10492292
RT T1
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
: T1
Cascode GaN device's Electrical Performance Failure Caused by Package Degradation under Repetitive Power Cycling Stress
UL https://suche.suub.uni-bremen.de/peid=ieee-10492292&Exemplar=1&LAN=DE A1 Shi, Yijun A1 Wu, Shan A1 He, Zhiyuan A1 Cai, Zongqi A1 Cheng, Liye A1 Rao, Yunliang A1 Xiao, Qingzhong A1 Chen, Yiqiang A1 Lu, Guoguang YR 2023 SN 2836-9734 K1 Degradation K1 Performance evaluation K1 Thermal resistance K1 Logic gates K1 HEMTs K1 Electronic packaging thermal management K1 Threshold voltage K1 GaN HEMTs K1 Power Cycling Test K1 Package Degradation K1 Chip-level Degradation SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT59018.2023.10492292 DO https://doi.org/10.1109/ICEPT59018.2023.10492292 SF ELIB - SuUB Bremen
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