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1 Ergebnisse
1
Investigation on the Influence of Frame Structure on Substr..:
, In:
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
,
Li, Xiaodong
;
Li, Helong
;
Wang, Dingyi
.. - p. 1-4 , 2023
Link:
https://doi.org/10.1109/ICEPT59018.2023.10492302
RT T1
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
: T1
Investigation on the Influence of Frame Structure on Substrate Stress in IGBT Modules
UL https://suche.suub.uni-bremen.de/peid=ieee-10492302&Exemplar=1&LAN=DE A1 Li, Xiaodong A1 Li, Helong A1 Wang, Dingyi A1 Pan, Nian'An A1 Zhang, Zhongbiao YR 2023 SN 2836-9734 K1 Insulated gate bipolar transistors K1 Insulation K1 Force K1 Fasteners K1 Mathematical models K1 Finite element analysis K1 Heat sinks K1 IGBT module K1 insulated substrate K1 reinforcement rib K1 segment difference SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT59018.2023.10492302 DO https://doi.org/10.1109/ICEPT59018.2023.10492302 SF ELIB - SuUB Bremen
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