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1 Ergebnisse
1
Effect of dimension and defects on the flexibility of ultra..:
, In:
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
,
Pan, Yan
;
Zhang, Shuye
;
Jin, Taiyu
... - p. 1-4 , 2023
Link:
https://doi.org/10.1109/ICEPT59018.2023.10492311
RT T1
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
: T1
Effect of dimension and defects on the flexibility of ultra-thin chips for wearable electronics
UL https://suche.suub.uni-bremen.de/peid=ieee-10492311&Exemplar=1&LAN=DE A1 Pan, Yan A1 Zhang, Shuye A1 Jin, Taiyu A1 Zhu, Pengli A1 Sun, Rong A1 Paik, Kyung-Wook YR 2023 SN 2836-9734 K1 Tensile stress K1 Shape K1 Simulation K1 Surface morphology K1 Bending K1 Silicon K1 Surface roughness K1 Silicon chip flexibility K1 FEA simulation K1 Surface defects K1 Sopori etch method SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT59018.2023.10492311 DO https://doi.org/10.1109/ICEPT59018.2023.10492311 SF ELIB - SuUB Bremen
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