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1 Ergebnisse
1
A 3D Crystal plasticity finite element model for a 3D packa..:
, In:
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
,
Liu, Shijiao
;
Cheng, Yujie
;
Gan, Linhai
... - p. 1-6 , 2023
Link:
https://doi.org/10.1109/ICEPT59018.2023.10492318
RT T1 <cTitle>2023 24th International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>A 3D Crystal plasticity finite element model for a 3D package under drop impact</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10492318&Exemplar=1&LAN=DE A1 Liu, Shijiao A1 Cheng, Yujie A1 Gan, Linhai A1 Hu, Shanwen A1 Cai, Zhikuang A1 Liu, Lu YR 2023 SN 2836-9734 K1 Deformable models K1 Analytical models K1 Solid modeling K1 Three-dimensional displays K1 Deformation K1 Finite element analysis K1 Soldering K1 CPFE model K1 3D package K1 solder joints K1 drop impact SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT59018.2023.10492318 DO https://doi.org/10.1109/ICEPT59018.2023.10492318 SF ELIB - SuUB Bremen
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