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1 Ergebnisse
1
The Effect of Pore Defects on the Interfacial Thermal Resis..:
, In:
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
,
Yang, Chao
;
Zhao, Pengfei
;
Wang, Jian
... - p. 1-5 , 2023
Link:
https://doi.org/10.1109/ICEPT59018.2023.10492329
RT T1 <cTitle>2023 24th International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>The Effect of Pore Defects on the Interfacial Thermal Resistance of GaN-Diamond Heterostructure</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10492329&Exemplar=1&LAN=DE A1 Yang, Chao A1 Zhao, Pengfei A1 Wang, Jian A1 Ma, Dezhi A1 He, Zhiyuan A1 Fu, Zhiwei A1 Yang, Jia-Yue YR 2023 SN 2836-9734 K1 Thermal resistance K1 Scattering K1 Phonons K1 Thermal management K1 Electronic packaging thermal management K1 Thermal analysis K1 Heat transfer K1 GaN-diamond interfaces K1 pore defect K1 interfacial thermal resistance K1 thermal management SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT59018.2023.10492329 DO https://doi.org/10.1109/ICEPT59018.2023.10492329 SF ELIB - SuUB Bremen
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