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1 Ergebnisse
1
Finite Element Simulation Study of the Effects of Kirkendal..:
, In:
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
,
Luo, Ming-Sheng
;
Wang, Hong-Guang
;
Chen, Bin
.. - p. 1-5 , 2023
Link:
https://doi.org/10.1109/ICEPT59018.2023.10492349
RT T1
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
: T1
Finite Element Simulation Study of the Effects of Kirkendall Voids in IMC Layer on Interfacial Crack and Reliability of Cu–Sn Solder Joint
UL https://suche.suub.uni-bremen.de/peid=ieee-10492349&Exemplar=1&LAN=DE A1 Luo, Ming-Sheng A1 Wang, Hong-Guang A1 Chen, Bin A1 Lyu, Guang-Chao A1 Zhang, Xin-Ping YR 2023 SN 2836-9734 K1 Three-dimensional displays K1 Simulation K1 Aggregates K1 Market research K1 Finite element analysis K1 Reliability K1 Intermetallic K1 IMC K1 Kirkendall void K1 Crack propagation SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT59018.2023.10492349 DO https://doi.org/10.1109/ICEPT59018.2023.10492349 SF ELIB - SuUB Bremen
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