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Board Level Solder Joint Thermal Fatigue Reliability Improv..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Li, Mengyuan ; Shi, Hongbin ; Lv, Xiang - p. 1-5 , 2023
Link: https://doi.org/10.1109/ICEPT59018.2023.10492355