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1 Ergebnisse
1
Thermal Management Method of Three-dimensional Integrated I..:
, In:
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
,
Zhou, Wangjun
;
Qu, Chenbing
;
Fu, Zhiwei
... - p. 1-4 , 2023
Link:
https://doi.org/10.1109/ICEPT59018.2023.10492358
RT T1 <cTitle>2023 24th International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Thermal Management Method of Three-dimensional Integrated Inductors Based on Dielectric-cavity TSV Technology</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10492358&Exemplar=1&LAN=DE A1 Zhou, Wangjun A1 Qu, Chenbing A1 Fu, Zhiwei A1 Chen, Si A1 Wang, Liwei A1 Sun, Chen YR 2023 SN 2836-9734 K1 Heating systems K1 Q-factor K1 Three-dimensional displays K1 Temperature K1 Thermal management K1 Finite element analysis K1 Thermal analysis K1 three-dimensional integrated inductor K1 thermal management K1 dielectric cavity K1 TSV K1 finite element analysis SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT59018.2023.10492358 DO https://doi.org/10.1109/ICEPT59018.2023.10492358 SF ELIB - SuUB Bremen
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