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1 Ergebnisse
1
Selective Wet Etching Technology in 3D NAND Flash Manufactu..:
, In:
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
,
Zhou, Zihan
;
Han, Silin
;
Wu, Yunwen
... - p. 1-5 , 2023
Link:
https://doi.org/10.1109/ICEPT59018.2023.10492364
RT T1
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
: T1
Selective Wet Etching Technology in 3D NAND Flash Manufacturing
UL https://suche.suub.uni-bremen.de/peid=ieee-10492364&Exemplar=1&LAN=DE A1 Zhou, Zihan A1 Han, Silin A1 Wu, Yunwen A1 Hang, Tao A1 Ling, Huiqin A1 Guo, Jie A1 Wang, Su A1 Li, Ming YR 2023 SN 2836-9734 K1 Silicon compounds K1 Performance evaluation K1 Wet etching K1 Three-dimensional displays K1 Additives K1 Stacking K1 Fluorine K1 3D NAND K1 phosphoric acid K1 wet etching K1 silicon nitride K1 silicon dioxide K1 etch selectivity SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT59018.2023.10492364 DO https://doi.org/10.1109/ICEPT59018.2023.10492364 SF ELIB - SuUB Bremen
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