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1 Ergebnisse
1
A Novel Focused Induction Heating Method For The Interconne..:
, In:
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
,
Cui, Peng
;
Li, Haosong
;
Yang, Fan
... - p. 1-5 , 2023
Link:
https://doi.org/10.1109/ICEPT59018.2023.10492366
RT T1 <cTitle>2023 24th International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>A Novel Focused Induction Heating Method For The Interconnection Between High-power Devices And Integrated Circuit Board</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10492366&Exemplar=1&LAN=DE A1 Cui, Peng A1 Li, Haosong A1 Yang, Fan A1 Zhu, Wenbo A1 Hu, Bo A1 Li, Mingyu YR 2023 SN 2836-9734 K1 Electromagnetic heating K1 Temperature K1 Printed circuits K1 Integrated circuit interconnections K1 Magnetic devices K1 Structural engineering K1 Magnetic fields K1 Novel focused induction heating method K1 interconnection K1 localized heating K1 magnetic field control SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT59018.2023.10492366 DO https://doi.org/10.1109/ICEPT59018.2023.10492366 SF ELIB - SuUB Bremen
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