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Experimental study on the growth behavior of Ni3Sn4 interme..:
, In:
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
,
Wang, Yuexing
;
Zhang, Xiangou
;
Cao, Linwei
... - p. 1-3 , 2023
Link:
https://doi.org/10.1109/ICEPT59018.2023.10492381
RT T1 <cTitle>2023 24th International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Experimental study on the growth behavior of Ni3Sn4 intermetallic compound within single-layer SnAg micro solder bumps considering ultra-long time</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10492381&Exemplar=1&LAN=DE A1 Wang, Yuexing A1 Zhang, Xiangou A1 Cao, Linwei A1 Sun, Xiangyu A1 Li, Shun A1 Yao, Zhifeng YR 2023 SN 2836-9734 K1 Grain size K1 Micrometers K1 Materials reliability K1 Aging K1 Atoms K1 Nickel K1 Microelectronics K1 Micro Solder bump K1 Ni3Sn4 K1 Intermetallic Compound SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT59018.2023.10492381 DO https://doi.org/10.1109/ICEPT59018.2023.10492381 SF ELIB - SuUB Bremen
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