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1 Ergebnisse
1
Design and Integration Approach of Low-Inductance Vertical ..:
, In:
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
,
Fan, Yinxiang
;
Yan, Haidong
;
Yang, Daoguo
... - p. 1-6 , 2023
Link:
https://doi.org/10.1109/ICEPT59018.2023.10492382
RT T1
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
: T1
Design and Integration Approach of Low-Inductance Vertical Interconnection Structure for Gallium-Nitride High Electron Mobility Transistors
UL https://suche.suub.uni-bremen.de/peid=ieee-10492382&Exemplar=1&LAN=DE A1 Fan, Yinxiang A1 Yan, Haidong A1 Yang, Daoguo A1 Li, Wangyun A1 Liu, Chaohui A1 Zhang, Yakun YR 2023 SN 2836-9734 K1 Inductance K1 Silver K1 Voltage measurement K1 Thermomechanical processes K1 Sintering K1 Switches K1 HEMTs K1 GaN HEMT K1 silver sintering K1 low parasitic inductance K1 topside interconnections K1 thermomechanical stress SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT59018.2023.10492382 DO https://doi.org/10.1109/ICEPT59018.2023.10492382 SF ELIB - SuUB Bremen
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